RO3003 2-Layer PCB: High-Performance Solution for RF and Microwave Applications
The RO3003 2-layer PCB is a specialized high-frequency circuit board designed for RF (Radio Frequency) and microwave applications. Built with Rogers RO3003 laminates, this PCB offers low signal loss, thermal stability, and exceptional reliability. It is ideal for demanding applications such as automotive radar systems, 5G wireless infrastructure, and satellite antennas.
Construction Details
| Parameter | Specification |
| Base Material | Rogers RO3003 |
| Layer Count | 2 layers |
| Board Dimensions | 33mm x 63mm |
| Minimum Trace/Space | 5/7 mils |
| Minimum Hole Size | 0.3mm |
| Blind Vias | None |
| Finished Thickness | 1.4mm |
| Copper Weight | 1oz (35μm) per outer layer |
| Via Plating Thickness | 20μm |
| Surface Finish | Immersion Gold (ENIG) |
| Top Silkscreen | Black |
| Bottom Silkscreen | None |
| Top Solder Mask | None |
| Bottom Solder Mask | None |
| Electrical Testing | 100% tested before shipment |
Key Features of RO3003 Material
- Dielectric Constant (Dk): 3.0 ± 0.04 at 10GHz, ensuring consistent performance over a wide frequency range.
- Dissipation Factor (Df): 0.001 at 10GHz, enabling minimal signal loss and high efficiency.
- Thermal Decomposition Temperature (Td): >500°C, ensuring excellent thermal reliability in extreme conditions.
- Thermal Conductivity: 0.5 W/mK, enabling effective heat dissipation in high-power designs.
- Moisture Absorption: 0.04%, making it suitable for humid or challenging environments.
- CTE (Coefficient of Thermal Expansion): X-axis: 17 ppm/°C. Y-axis: 16 ppm/°C. Z-axis: 25 ppm/°C.
Benefits of the RO3003 PCB
The low dissipation factor (Df) of 0.001 minimizes signal loss, making this PCB ideal for high-frequency applications up to 77GHz, such as automotive radar and satellite communication systems.
The consistent Dk of 3.0 ± 0.04 ensures stable performance over a wide range of temperatures and frequencies, which is crucial for bandpass filters, patch antennas, and more.
With a thermal decomposition temperature (Td) of over 500°C and thermal conductivity of 0.5 W/mK, this PCB dissipates heat efficiently, ensuring reliable performance in high-power RF systems.
The low CTE values allow the PCB to maintain its shape and size under thermal stress, making it highly reliable for surface-mounted assemblies and hybrid designs.
With a moisture absorption rate of just 0.04%, the RO3003 PCB is ideal for marine, aerospace, and outdoor environments where humidity is a concern.
Applications of the RO3003 PCB
Automotive Radar Systems
GPS Antennas
5G Wireless Infrastructure
Patch Antennas
Satellite Communication
Microwave Transmission Devices
Remote Meter Readers
Power Backplanes
Why Choose the RO3003 PCB?
The RO3003 2-layer PCB is the ultimate solution for high-frequency and RF designs. With its low dielectric loss, thermal stability, and high reliability, it offers exceptional performance across a wide range of applications. Whether you’re designing for automotive radar, 5G wireless systems, or satellite communications, the RO3003 PCB delivers consistent results.
Key Advantages
- Exceptional signal integrity up to 77GHz.
- Thermal stability for high-power applications.
- Cost-effective and reliable for volume production.
- Compatible with multi-layer hybrid designs for advanced systems.
Conclusion
The RO3003 2-layer PCB is designed to meet the most demanding requirements of RF and microwave applications. Its ceramic-filled PTFE construction, low dissipation factor, and stable dielectric constant make it a standout choice for engineers and designers. With its reliability, cost-effectiveness, and versatility, the RO3003 PCB supports cutting-edge technologies in automotive, aerospace, telecommunications, and beyond.
Ready to elevate your designs? Contact us today to learn more about the RO3003 PCB and how it can enhance your next project!
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Rogers RO3003 laminates High-frequency 2-layer RF PCB using in Automotive radar design, Patch antennas Images
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