TLY-3 2-Layer PCB: 20mil with Silver Gold Finish
The TLY-3 2-layer PCB is a high-performance circuit board designed for high-frequency RF and microwave applications. Featuring TLY-3 laminates, this PCB provides dimensional stability, low dielectric loss, and high peel strength, making it ideal for automotive radar, satellite communications, and phased array antennas. The Silver Gold finish (gold over silver) ensures superior solderability and signal integrity, providing reliability for millimeter-wave frequency designs.
Key Construction Details
| Parameter | Specification |
| Base Material | TLY-3 |
| Layer Count | 2-layer (double-sided) |
| Board Dimensions | 125mm x 47mm (± 0.15mm) |
| Minimum Trace/Space | 4/6 mils |
| Minimum Hole Size | 0.3mm |
| Blind Vias | None |
| Finished Thickness | 0.6mm |
| Copper Weight | 1oz (35μm) on both layers |
| Via Plating Thickness | 20μm |
| Surface Finish | Silver plate / Gold plate (Gold over Silver) |
| Top Silkscreen | None |
| Bottom Silkscreen | None |
| Top Solder Mask | None |
| Bottom Solder Mask | None |
| Electrical Testing | 100% tested prior to shipment |
Features of TLY-3 Material
- Dielectric Constant (Dk): 2.33 ± 0.02 at 10GHz, ensuring stable signal propagation.
- Dissipation Factor (Df): 0.0012 at 10GHz for minimal signal loss.
- Thermal Conductivity: 0.22 W/mK for efficient heat dissipation.
- CTE (Coefficient of Thermal Expansion): X-axis: 26 ppm/°C, Y-axis: 15 ppm/°C, Z-axis: 217 ppm/°C
- Peel Strength: 17 lbs/in for 1oz copper cladding.
- Moisture Absorption: 0.02%, ensuring reliability in humid environments.
- Flammability Rating: UL 94 V-0 for safety in high-risk applications.
- Outgassing: Low outgassing characteristics (TML: 0.01%, CVCM: 0.01%) for aerospace and space applications.
Data Sheet of Taconic TLY Material
| TLY TYPICAL VALUES |
| Property | Test Method | Unit | Value | Unit | Value |
| DK at 10 GHz | IPC-650 2.5.5.5 | | 2.2 | | 2.2 |
| Df at 10 GHz | IPC-650 2.5.5.5 | | 0.0009 | | 0.0009 |
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.02 | % | 0.02 |
| Dielectric Breakdown | IPC-650 2.5.6 | kV | >45 | kV | >45 |
| Dielectric Strength | ASTM D 149 | V/mil | 2,693 | V/mil | 106,023 |
| Volume Resistivity | IPC-650 2.5.17.1(after elevated temp.) | Mohms/cm | 1010 | Mohms/cm | 1010 |
| Volume Resistivity | IPC-650 2.5.17.1(after humidity) | Mohms/cm | 1010 | Mohms/cm | 109 |
| Surface Resistivity | IPC-650 2.5.17.1(after elevated temp.) | Mohms | 108 | Mohms | 108 |
| Surface Resistivity | IPC-650 2.5.17.1(after humidity) | Mohms | 108 | Mohms | 108 |
| Flex Strength(MD) | IPC-650 2.4.4 | psi | 14,057 | N/mm2 | 96.91 |
| Flex Strength(CD) | IPC-650 2.4.4 | psi | 12,955 | N/mm2 | 89.32 |
| Peel Stength(½ oz.ed copper) | IPC-650 2.4.8 | Ibs./inch | 11 | N/mm | 1.96 |
| Peel Stength(1 oz.CL1 copper) | IPC-650 2.4.8 | Ibs./inch | 16 | N/mm | 2.86 |
| Peel Stength(1 oz..CV1 copper) | IPC-650 2.4.8 | Ibs./inch | 17 | N/mm | 3.04 |
| Peel Stength | IPC-650 2.4.8(after elevated temp.) | Ibs./inch | 13 | N/mm | 2.32 |
| Young's Modulus(MD) | ASTM D 3039/IPC-650 2.4.19 | psi | 1.4 x 106 | N/mm2 | 9.65 x 103 |
| Poisson's Ratio(MD) | ASTM D 3039/IPC-650 2.4.19 | | 0.21 | | 0.21 |
| Thermal Conductivity | ASTM F 433 | W/M*K | 0.22 | W/M*K | 0.22 |
| Dimensional Stability(MD,10mil) | IPC-650 2.4.39(avg.after bake&thermal stress) | mils/inch | -0.038 | | -0.038 |
| Dimensional Stability(CD,10mil) | IPC-650 2.4.39(avg.after bake&thermal stress) | mils/inch | -0.031 | | -0.031 |
| Density(Specific Gravity) | ASTM D 792 | g/cm3 | 2.19 | g/cm3 | 2.19 |
| CTE(X axis)(25-260℃) | ASTM D 3386(TMA) | ppm/℃ | 26 | ppm/℃ | 26 |
| CTE(Y axis)(25-260℃) | ASTM D 3386(TMA) | ppm/℃ | 15 | ppm/℃ | 15 |
| CTE(Z axis)(25-260℃) | ASTM D 3386(TMA) | ppm/℃ | 217 | ppm/℃ | 217 |
| NASA Outgassing(% TML) | | | 0.01 | | 0.01 |
| NASA Outgassing(% CVCM) | | | 0.01 | | 0.01 |
| NASA Outgassing(% WVR) | | | 0.00 | | 0.00 |
| UL-94 Flammability Rating | UL-94 | | V-0 | | V-0 |
Applications of TLY-3 PCB
Automotive Radar Systems
Satellite and Cellular Communications
Power Amplifiers
Low Noise Block Converters (LNBs), Low Noise Amplifiers (LNAs), and Low Noise Combiners (LNCs)
Aerospace Applications
Ka, E, and W Band Applications
Filters and Couplers
Phased Array Antennas
Why Choose TLY-3 PCB?
Superior High-Frequency Performance: The low Dk (2.33 ± 0.02) and low Df (0.0012) ensure minimal signal loss and stable performance at millimeter-wave frequencies.
Reliable in Harsh Environments: High peel strength, low moisture absorption, and low outgassing make it ideal for aerospace, automotive, and outdoor systems.
Ease of Manufacturing: The woven fiberglass matrix provides dimensional stability, enabling high manufacturing yields.
Environmentally Friendly: The PCB meets UL 94 V-0 flammability standards and exhibits low outgassing, ensuring sustainability and safety.
The TLY-3 2-layer PCB is the perfect solution for RF and microwave engineers seeking low-loss, high-reliability materials for advanced communication and radar systems.
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TLY-3 double-side laminate with Gold over silver finish using in Automotive radar Images
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